WAFER-MX1.25-4PWZ-R62-XUNPU-1x4P 4P PicoBlade(MX 1.25) Tin 4 -25℃~+85℃ 1 1.25mm Copper alloy Bend-in Push-Pull,P=1.25mm Wire To Board Connector ROHS.
Note: Images for reference only.
Specifications:
Manufacturer: XUNPU
Package: Push-Pull,P=1.25mm
Y-Width of Bottom Edge on Board: 4.7mm
Pins Structure: 1x4P
Number of Pins: 4P
Reference Series: PicoBlade(MX 1.25)
Contact Plating: Tin
Row Spacing: –
Number of PINs Per Row: 4
Operating Temperature: -25℃~+85℃
Current Rating: –
Plastic Material: PA66
Color: Red
Number of Rows: 1
Supplementary Features: –
Pitch: 1.25mm
Flame Retardant Rating: UL94V-2
Voltage Rating: 125V
Contact Material: Copper alloy
X-Length of Bottom Edge on Board (Spacing Line): –
Z-Height of the Board: 3.2mm
Mounting Type: Right-Angle
For detailed specifications, please refer to datasheet in Attachments.
Package Includes:
1 x WAFER-MX1.25-4PWZ-R62-XUNPU-1x4P 4P PicoBlade(MX 1.25) Tin 4 -25℃~+85℃ 1 1.25mm Copper alloy Bend-in Push-Pull,P=1.25mm Wire To Board Connector ROHS
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